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  cha4105-qdg rohs compliant ref. : dsch4105-qdg0329 - 25 nov 10 1/12 specifications subject to change without notic e united monolithic semiconductors s.a.s. route dpartementale 128 - bp46 - 91401 orsay cedex france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 2-4ghz driver gaas monolithic microwave ic in smd leadless packag e description the cha4105-qdg is a monolithic two- stage driver amplifier delivering 24dbm output power @ 1db gain compression in the range 2-4ghz. it is designed for a wide range of applications, from military to commercial communication systems. the circuit is manufactured with a phemt process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. it is supplied in rohs compliant smd package. main features broadband performances: 2-4ghz 24dbm @ 1db gain compression 23db gain dc bias: v+ = 5v ; v- = -5v dc power consumption: 180ma qfn4x4 main characteristics tamb.= +25c symbol parameter min typ max unit freq frequency range 2 4 ghz gain linear gain 23 db pout output power @1db comp. 24 dbm ums a4105 yyww     
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 2/12 specificat ions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 main characteristics tamb.= +25c symbol parameter min typ max unit freq frequency range 2 4 ghz gain linear gain 23 db rl_in input return loss 15 db rl_out output return loss 18 db p_1db output power @ 1db gain compression 24 dbm pae_1db power added efficiency @ 1dbcomp. 28 % nf noise figure 5 db v+ positive supply voltage 5 v v- negative supply voltage -5 v i+ positive supply quiescent current (1) 180 ma i- negative supply quiescent current 5 ma i+_1db positive current @ 1db gain compression 220 ma these values are representative of onboard measurem ents as defined on the drawing in paragraph "evaluation mother board". (1) parameter can be adjusted by tuning of v-. absolute maximum ratings (1) tamb.= +25c symbol parameter values unit v+ positive supply voltage 6.5v v i+ positive supply quiescent current 240 ma v- negative supply voltage -3.75 v tj junction temperature (2) 175 c cmp compression level 6 db i+_sat supply current in saturation 320 ma ta operating temperature range -40 to +85 c tstg storage temperature range -55 to +155 c (1) operation of this device above anyone of these par ameters may cause permanent damage. (2) thermal resistance channel to ground paddle: 65c/ w for tamb. = +83c with 5v & 180ma.
2-4ghz driver cha4105-qdg ref. : dsch4105-qdg0329 - 25 nov 10 3/12 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 device thermal performances all the figures given in this section are obtained assuming that the qfn device is cooled down only by conduction through the package thermal pad (no convection mode considered). the temperature is monitored at the package back-si de interface (tcase) as shown below. the system maximum temperature must be adjusted in order to guarantee that tcase remains below than the maximum value specified in t he next table. so, the system pcb must be designed to comply with this requirement. a derating must be applied on the dissipated power if the tcase temperature can not be maintained below than the maximum temperature speci fied (see the curve pdiss. max) in order to guarantee the nominal device life time (mt tf). recommended max. junction temperature (tj max) : 175 c junction temperature absolute maximum rating : 175 c max. continuous dissipated power @ tcase= 83 c : 1,4 w => pdiss derating above tcase (1) = 83 c : 15 mw/c junction-case thermal resistance (rth j-c) (2) : <65 c/w min. package back side operating temperature (3) : -40 c max. package back side operating temperature (3) : 83 c min. storage temperature : -55 c max. storage temperature : 125 c (1) derating at junction temperature constant = tj max (2) rth j-c is calculated for a worst case where th e hotter junction of the mmic is considered. (3) tcase=package back side temperature measured un der the die-attach-pad (see the drawing below). 5,8 device thermal specification : product name 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 -50 -25 0 25 50 75 100 125 tcase (c) pdiss. max. (w) pdiss. max. (w) tcase example of qfn 16l 3x3 back-side view, temperature reference point (tcase) location.
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 4/12 specificat ions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements v+ = +5v, v- = -5v, i+ = 180ma, i- = 2ma linear gain in/out return loss
2-4ghz driver cha4105-qdg ref. : dsch4105-qdg0329 - 25 nov 10 5/12 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements v+ = +5v, v- = -5v, i+ = 180ma, i- = 2ma output power @ 1db gain compression versus frequenc y & temperature positive supply current @ 1db gain compression vers us frequency & temperature
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 6/12 specificat ions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements v+ = +5v, v- = -5v, i+ = 180ma, i- = 2ma output power @ saturation versus frequency & temper ature positive supply current @ saturation versus freque ncy & temperature
2-4ghz driver cha4105-qdg ref. : dsch4105-qdg0329 - 25 nov 10 7/12 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements v+ = +5v, v- = -5v, i+ = 180ma, i- = 2ma power added efficiency (pae) @ 1db gain compression versus frequency & temperature noise figure versus frequency & temperature
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 8/12 specificat ions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 package outline (1) matt tin. lead free (green) 1- nc 11- nc 21- v+ units : mm 2- nc 12- nc 22- nc from the standard : jedec mo-220 3- nc 13- nc 23- v- (vggd) 4- rf in 14- nc 24- nc 25- gnd 5- nc 15- rf out 6- nc 16- nc 7- nc 17- nc 8- nc 18- nc 9- gnd (2) 19- nc 10- nc 20- gnd (2) (1) the package outline drawing included to this data- sheet is given for indication. refer to the application note an0017 ( http://www.ums-gaas.com ) for exact package dimensions. (2) it is strongly recommended to ground all pins mark ed gnd through the pcb board. ensure that the pcb board is designed to provide th e best possible ground to the package.
2-4ghz driver cha4105-qdg ref. : dsch4105-qdg0329 - 25 nov 10 9/12 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 evaluation mother board compatible with the proposed footprint. based on typically ro4003 / 8mils or equivalent. using a micro-strip to coplanar transition to acce ss the package. recommended for the implementation of this product on a module board. decoupling capacitors of 10nf 10% are recommended for all dc accesses. see application note an0017 for details.
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 10/12 specifica tions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 dc schematic driver : 5v, 180ma 28 ma v- v+ 6000 w rf_in 30 w 150 ma 9000 w rf_out 6310 w 1100 w 4000 w 1015 w 0.6 ma 2.7 ma 28 ma v- v+ 6000 w rf_in 30 w 150 ma 9000 w rf_out 6310 w 1100 w 4000 w 1015 w 0.6 ma 2.7 ma
2-4ghz driver cha4105-qdg ref. : dsch4105-qdg0329 - 25 nov 10 11/12 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 notes
cha4105-qdg 2-4ghz driver ref. : dsch4105-qdg0329 - 25 nov 10 12/12 specifica tions subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 recommended package footprint refer to the application note an0017 available at http://www.ums-gaas.com for package foot print recommendations. smd mounting procedure for the mounting process standard techniques involv ing solder paste and a suitable reflow process can be used. for further details, see appli cation note an0017. recommended environmental management refer to the application note an0019 available at http://www.ums-gaas.com for environmental data on ums package products. recommended esd management refer to the application note an0020 available at http://www.ums-gaas.com for esd sensitivity and handling recommendations for the um s package products. ordering information qfn 4x4 rohs compliant package: cha4105-qdg/xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate an d reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by impli cation or otherwise under any patent or patent rights of united monolithic semiconductors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and re places all information previously supplied. united monolithic semiconductors s.a.s. products are not authorised for use as critical components in life support devices or s ystems without express written approval from united monolithic semiconductors s.a.s.


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